一种面向IO Die的敏捷验证方法

计算机工程与科学 ›› 2023, Vol. 45 ›› Issue (04): 571-576.

一种面向IO Die的敏捷验证方法

罗莉,石伟，何鸿君，潘国腾，王蕾,龚锐

（国防科技大学计算机学院,湖南长沙 410073）

收稿日期:2022-10-03 修回日期:2022-12-25 接受日期:2023-04-25 出版日期:2023-04-25 发布日期:2023-04-13
基金资助:
科技部科技创新项目（2020AAA0104602）

An agile verification method of IO Die

LUO Li,SHI Wei,HE Hong-jun,PAN Guo-teng,WANG Lei,GONG Rui

(College of Computer Science and Technology,National University of Defense Technology,Changsha 410073，China)

Received:2022-10-03 Revised:2022-12-25 Accepted:2023-04-25 Online:2023-04-25 Published:2023-04-13

摘要/Abstract

摘要： IO Die可以用做IO 扩展芯片，也可作为芯粒（chiplet）复用于多个项目。提出一种面向IO Die的敏捷验证方法，验证平台包括子系统级、簇级、全片级3个层次，可实现测试激励的跨层次复用；针对各验证层次的测试激励的自动生成方式进行优化，分别采用覆盖率驱动、可配置约束产生、多目标优化策略，提高测试激励的生成效率。实验结果表明，该方法在保证效率和可靠性的前提下，可以降低验证成本，缩短验证时间，快速获得已知合格裸片KGD。

关键词: 裸片, 敏捷验证, 覆盖率驱动, 可配置约束, 多目标优化

Abstract: IO Die can be used as an IO extension chip, or a chiplet, which can be reused for multiple projects. This paper proposes an agile verification method of an IO Die. In order to reuse cross-level test cases, three levels (sub-system level, cluster level and whole chip level) are realized on the verification platform, and test cases at each verification level are optimized. Coverage drive, configurable constraint generation and multi-objective optimization methods are adopted respectively to improve the generation efficiency of test cases. Experimental results show that, this method can reduce the cost and time and effectively achieve Known Good Die (KGD) on the premise of ensuring efficiency and reliability.

Key words: Die, agile verification, coverage-driven, configurable constraint, multi-objective optimization

罗莉, 石伟, 何鸿君, 潘国腾, 王蕾, 龚锐. 一种面向IO Die的敏捷验证方法[J]. 计算机工程与科学, 2023, 45(04): 571-576.

LUO Li, SHI Wei, HE Hong-jun, PAN Guo-teng, WANG Lei, GONG Rui. An agile verification method of IO Die[J]. Computer Engineering & Science, 2023, 45(04): 571-576.