关键词: 陶瓷柱栅阵列（CCGA）, 植柱, 焊膏喷印, 焊接

Abstract: CCGA devices have been widely used in many high-reliability fields due to the excellent ability of absorbing mismatch of thermal expansion. In order to resolve the problems including the preparation and high-precision assembly of CCGA devices, this paper studies the preparation of ceramic shells, design of high-precision column planting tools, depositing of solder paste, and column planting of CCGA devices. By using high temperature cofired ceramic technique, two types of CCGA ceramic shells with daisy chains are prepared successfully, which can be used to design complex electronic circuits flexibly. High-precision column planting tools with 1.6 mm height and 0.54 mm diameter holes are designed and prepared. Solder printing and solder paste jetting methods are compared, and the later one is adopted to obtain more accuracy paste volume. The relative deviations of paste volumes are less than 10%. Based on these conditions, high-precision column planting CCGA devices, with column tilt<1°, coplanarity<0.1 mm, and tolerance of position better than ±0.02 mm, are then obtained. This method can effectively improve the column planting accuracy and solder column symmetry of CCGA devices, and help to ensure the accuracy and reliability of subsequent board-level soldering.

Key words: ceramic column grid array (CCGA), column planting, solder paste jetting, soldering