关键词: 晶圆级芯片, 遗传算法, 卷积网络映射, 人工智能, 通信开销

Abstract: In recent years, with the development of artificial intelligence, deep learning has become one of the most important computing loads today. The next generation of artificial intelligence (AI) and high-performance computing applications have put unprecedented demands on the computing power and communication capabilities of computing platforms. Wafer-scale chips integrate ultra-high-density transistors and interconnect communication capabilities on the entire wafer, so it is expected to provide revolutionary computing power solutions for future AI and super-computing platforms. Among them, the huge computing resources and unique new architecture of wafer-scale chips pose unprecedented challenges to task mapping algorithms. Related research has become a major focus of academic research in recent years. This paper focuses on studying the mapping methods of AI tasks on wafer-scale hardware resources. By expressing the AI algorithm as multiple convolutional kernels and considering the computational power characteristics of convolutional kernels, a mapping algorithm for wafer-scale chips is designed based on genetic algorithms. The simulation results under a series of mapping tasks verifies the effectiveness of the mapping algorithm and revealed the impact of parameters such as execution time and adapter cost on the cost function. 

Key words: wafer-scale chip, genetic algorithm, convolutional network mapping, artificial intelligence, communication overhead