随着单个芯片上集成的处理器的个数越来越多，传统的电互连网络已经无法满足对互连网络性能的需求，需要一种新的互连方式，因此光互连网络技术应运而生。目前，电互连的片上网络在功耗、性能、带宽、延迟等方面遇到了瓶颈，而光互连作为一种新的互连方式引用到片上网络具有低损耗、高吞吐率、低延迟等无可比拟的优势。本文主要探讨了片上光网络的研究趋势和发展方向，并对目前主要对基于总线结构和Torus结构的片上光网络进行了分析和比较，主要集中在拓扑结构、路由算法以及流控机制等方面。本文最后对片上光网络与3D技术结合以及全光片上互连网络的未来发展前景进行了探讨。

As the number of processing cores that are integrated into a chip multiprocessors (CMP) continues to grow ,the traditional electric interconnection cannot meet the demands on interconnection networks .Therefore,the technology of optical interconnection is brought forward. At present, the electrical interconnection network onchip encounters a bottleneck in power, performance, bandwidth and latency, and optical interconnect is introduced into network onchip as a new way of interconnection ,which has incomparable advantages for low power dissipation,high throughput and low latency .This paper introduces the evolution of optical networks on chip,and compares the busbased architecture to torus networks and analyses the topological configuration, routing algorithms and flow control of Optical NetworkonChip(ONoC) . Finally,the prospect of the combination of the optical network onchip and 3D technology,and all optical network onchip are also discussed.