关键词: 传输线 特性阻抗 信号完整性 连接器 过孔 高速串行传输 IBIS SPICE 多板分析 电路仿真

Abstract:

With the SERDES data rate approaching 10 Gbps, the transmission technology of PCB, especially the multiboard transmission, has become more and more di fficult. Understanding, designing and simulating the PCB and its features as precisely as possible is essential for optimizing the complete signal path, and the very high-speed serial links can be achieved. This paper firstly analyzes the framework of SERDES, and then studies and models the key features of the high- speed PCB design. As a result , the multi-board transmission model is built by using the experimental PCBs, and the key SERDES network tra   nsmission on multi-PCBs are simulated and analyzed.

Key words: transmission line, characteristic impedance, signal integrity, connector, via, SERDES, IBIS, SPICE, multiboard analysis, circuit simulation