• 中国计算机学会会刊
  • 中国科技核心期刊
  • 中文核心期刊

J4 ›› 2006, Vol. 28 ›› Issue (7): 105-108.

• 论文 • 上一篇    下一篇

无铅焊接中Lift-off现象产生的原因及抑制对策

李元山 陈旭   

  • 出版日期:2006-07-01 发布日期:2010-05-20

  • Online:2006-07-01 Published:2010-05-20

摘要:

本文首次提出三要素法来解释Lift-off的形成机理.相比传统的“Bi-Segregation”失效机理,“三要素法”可以解释含Bi和不合Bi的所有无铅钎料产生或不产生Lift-off的原 因,并由此找出了Lift-off的抑制对策.

关键词: 无铅钎料 波峰焊 Lift-off 三要素法

Abstract:

This paper puts forth the "three-factor method"for the first time to explain the forming mechanism of lift-off. Compared with the traditional "Bi-S egregation" invalidation mechanism, the"three-faetor method" can explain the causes of lift-off formed or non-formed by all lead-free solders with annd without bismuth. Finally, the restraining countermeasures against lift-off are also given.

Key words: lead-free solders wave soldering lift-off,three-factor method