J4 ›› 2006, Vol. 28 ›› Issue (7): 105-108.
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李元山 陈旭
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摘要:
本文首次提出三要素法来解释Lift-off的形成机理.相比传统的“Bi-Segregation”失效机理,“三要素法”可以解释含Bi和不合Bi的所有无铅钎料产生或不产生Lift-off的原 因,并由此找出了Lift-off的抑制对策.
关键词: 无铅钎料 波峰焊 Lift-off 三要素法
Abstract:
This paper puts forth the "three-factor method"for the first time to explain the forming mechanism of lift-off. Compared with the traditional "Bi-S egregation" invalidation mechanism, the"three-faetor method" can explain the causes of lift-off formed or non-formed by all lead-free solders with annd without bismuth. Finally, the restraining countermeasures against lift-off are also given.
Key words: lead-free solders wave soldering lift-off,three-factor method
李元山 陈旭. 无铅焊接中Lift-off现象产生的原因及抑制对策[J]. J4, 2006, 28(7): 105-108.
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http://joces.nudt.edu.cn/CN/Y2006/V28/I7/105