［1］Bogatin E.Signal integrity:Simplified［M］. Beijing:Publishing House of Electronics Industry,2007.(in Chinese)
［2］Stephen H, Howard H . Advanced signal integrity for highspeed digital designs［M］. Beijing:Publishing House of Electronics Industry,2011.(in Chinese)
［3］Bogatin E. The role of dielectric constant and dissipation factor measurements in multi gigabit systems［C］∥Proc of DesignCon, 2007:1.
［4］Johnson H, Graham M. Highspeed digital design［M］.Beijing:Publishing House of Electronics Industry,2004.(in Chinese)
［5］Khilkevich V, Sivarajan V, Liu D, et al. A systematic approach to PCB material characterization using time domain TRL calibration［C］∥Proc of DesignCon, 2010:521537.
［6］Bogatin E, Gupta S, Resso M, et al. Practical analysis of backplane vias［C］∥Proc of DesignCon, 2009:569592.
［7］Hinaga S, Koledintseva M, Reddy P K, et al. Effect of conductor surface roughness upon measured loss and extracted values of PCB laminate material dissipation factor［C］∥Proc of IPC’09,2009:1.
［8］Resso M,Bogatin E. A really simple method to chacterize differential interconnects［C］∥Proc of DesignCon,2011:1.
［9］Huray P. Impact of copper surface texture on loss:A model tha works［C］∥Proc of DesignCon, 2010:1.
［10］Hinckley K. Introduction and comparison of an alternate methodology for measuring loss tangent of PCB laminates［C］∥Proc of DesignCon, 2010:1.
［11］Herrick C. Bounding the effect of glass weave through simulation［C］∥Proc of DesignCon, 2009:1.
附中文参考文献：
［1］Bogatin  E.信号完整性分析［M］.北京:电子工业出版社,2007.
［2］Stephen H,Howard H.高级信号完整性技术［M］.北京:电子工业出版社,2011.
［4］Johnson H, Graham M.高速数字系统设计［M］.北京：电子工业出版社，2004.