Abstract: Aiming at the interconnect design in the extended Chiplet area, the analysis methods and optimization measures of via crosstalk in BGA region are mainly studied. Firstly, modeling & calculating on unit array vias is proposed to evaluate the crosstalk of the whole BGA area vias. Then, a multi-layer fan-out modeling platform is constructed for analysis requirements of different wiring layers. Results from several unit array models and multi-layer fan-out model verify each other, indicating that taking the array unit as the minimum part to evaluate the crosstalk is accurate, and the multi-layer fan-out modeling method is efficient and feasible. PCB vias crosstalk corresponding to two different BGA pin assignment is analyzed by multi-layer fan-out modeling. Results show that increasing the ratio of spacing between neighboring signal vias to spacing between neighboring signal via and ground via is more effective than increasing the quantity of ground vias or the BGA pitch.

Key words: unit array, ball grid array(BGA), pin assignment, via, signal integration, crosstalk