• 中国计算机学会会刊
  • 中国科技核心期刊
  • 中文核心期刊

J4 ›› 2010, Vol. 32 ›› Issue (2): 139-141.doi: 10.3969/j.issn.1007130X.2010.

• 论文 • Previous Articles     Next Articles

Research on the Design of  Sealed Electronics’ Thermal Dispersion

  

  1. (School of Mechanical and Electrical Engineering,Guilin University of Electronic Technology,Guilin 541004,China)
  • Received:2008-11-06 Revised:2009-02-20 Online:2010-01-25 Published:2010-01-26

Abstract:

This paper presents an airtoair heat exchanger that is designed by taking into account the bad working environment of the open air. The internal cabinet temperature is regulated and the external circumstance is isolated effectively by the present device with the features of intelligent control, selfdiagnosis, compact structure and convenient maintenance. Meanwhile, a flow network model of the entire system is constructed by MacroFlow which is based on the Flow Network Modeling (FNM). Accordingly, longtime operation can be guaranteed and the application of the airtoair heat exchanger has a promising future.

Key words: air-to-air heat exchanger;thermal design;electronics heat dispersion;FNM

CLC Number: