Thermal Simulation and Design of a MultiChip Package

中国计算机学会会刊
中国科技核心期刊
中文核心期刊

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Thermal Simulation and Design of a MultiChip Package

WANG Jinlan1，TONG Liangyu1,2，LIU Peisheng1,2,3，MIAO Xiaoyong2

Computer Engineering & Science . 2012, (4): 28 -31 .