Design and implementation of TSV <br /> chain redundancy repair circuit in 3D chip

中国计算机学会会刊
中国科技核心期刊
中文核心期刊

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中文

Design and implementation of TSV
chain redundancy repair circuit in 3D chip

YUAN Qiang，ZHAO Zhenyu，DOU Qiang，LI Peng，LIU Haibin

Computer Engineering & Science . 2014, (05): 828 -835 .