Modeling power distribution network in <br /> TSV-based 3D-IC with silicon substrate effect

中国计算机学会会刊
中国科技核心期刊
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中文

Modeling power distribution network in
TSV-based 3D-IC with silicon substrate effect

SUN Hao1，ZHAO Zhenyu1,LIU Xin2

Computer Engineering & Science . 2014, (12): 2339 -2345 .