中国计算机学会会刊
中国科技核心期刊
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Impact of “one testing after multiple bondings” on the testing process in “mid-bond tests”
QIN Zhen-lu1,2,FANG Fang1,WANG Wei1,2,ZHU Xia1,2,GUO Er-hui3,REN Fu-ji1,2
Computer Engineering & Science . 2016, (
08
): 1602 -1608 .