Abstract: IO Die can be used as an IO extension chip, or a chiplet, which can be reused for multiple projects. This paper proposes an agile verification method of an IO Die. In order to reuse cross-level test cases, three levels (sub-system level, cluster level and whole chip level) are realized on the verification platform, and test cases at each verification level are optimized. Coverage drive, configurable constraint generation and multi-objective optimization methods are adopted respectively to improve the generation efficiency of test cases. Experimental results show that, this method can reduce the cost and time and effectively achieve Known Good Die (KGD) on the premise of ensuring efficiency and reliability. 

Key words: Die, agile verification, coverage-driven, configurable constraint, multi-objective optimization