Abstract: Aiming at the heat dissipation problem of a 6U VPX high-performance motherboard with many heating devices and large total thermal power consumption, An engineering application experimental research on the aluminous vapor chamber is carried out. The test results show that the aluminous vapor chamber cannot meet the heat dissipation requirements of the motherboard under natural heat dissipation conditions at the normal temperature of 28 ℃, the maximum temperature difference on the aluminous vapor chamber is 7.2 ℃ under the air-cooled heat dissipation condition, and the maximum junction temperature of the CPU and DSP chips is 45 ℃ and 50 ℃ respectively. The maximum temperature difference on the aluminous vapor chamber is 6.7 ℃ at a 60 ℃-high temperature environment, and the maximum junction temperature of the CPU and DSP chips is 85 ℃ and 83 ℃ respectively, which is lower than the allowable junction temperature of 105 ℃. It is concluded that the heat dissipation performance of the aluminous vapor chamber is remarkable, and it can meet the heat dissipation requirements of the standard 6U VPX high-performance and high-power consumption motherboard with air-cooling conditions, which is one of the effective methods to solve the heat dissipation difficulty of the motherboard.