Abstract: With the continuous improvement of differential signal rate,the impact of traditional differential via discontinuity on signal integrity is becoming more and more noticeable.In order to solve the problem of signal reflection,attenuation and impedance discontinuity in the vertical direction of multi-layer PCB,it is urgent to carry out the research on new vertical differential structure.Firstly,the three-dimensional electromagnetic simulation software HFSS is used to construct two types of strip vertical differential structure,Model I and Model II,and the traditional differential via model.Secondly,the transmission performance of the two strip vertical differential structures are simulated and analyzed,and it is found that  Model I  outperformed Model II in transmission performance.Thirdly,the influence of structural parameters on the electrical performance transmission parameters of the Model I type of strip vertical differential structure is analyzed.Finally,the electrical performance transmission parameters of the Model I type of strip vertical differential structure and the traditional differential via are compared and analyzed,and verified in the timedomain eye diagram.The results show that the transmission performance of the Model I type can be improved by reducing the size of the surface connection pad,the depth of the vertical conductor,and the length of the stub,increasing the diameter of drill hole and the size of anti-pad.Compared with the traditional differential via conversion,the Model I type conversion increases the eye height and eye width by 4.47% and 4.31% respectively,and reduces the jitter by
 57.16%,the Model I type has better timedomain transmission performance.

Key words: differential signal, signal integrity, impedance discontinuity, strip vertical differential structure, time domain eye diagram