关键词: FPGA, 辐射发射, 近场扫描, 电磁屏蔽材料, 电磁辐射抑制

Abstract: With the continuous development of semiconductor technology, the circuit speed, integration density and the number of I/O ports of integrated circuits have greatly increased. The miniaturization and high-density integration of FPGAs will cause electromagnetic compatibility problems. Electromagnetic shielding is the most effective way to suppress the electromagnetic radiation. Choosing efficient electromagnetic shielding materials can achieve good shielding effects. At present, electromagnetic shielding materials are rarely used in FPGA, so we select a representative high-performance FPGA as the research object, and study its electromagnetic emission in different program states through near field scanning experiment. According to the characteristics of the chip, the composite metal shield and the absorbent waveguide electric sponge are selected as the electromagnetic shielding materials to suppress the radiation emission of FPGA. Through further verification and analysis in experiments, the results show that the shield made of metal composite has better shielding effectiveness, and reaches 10 dBm. In contrast, the compressibility and structural stability of the wave-absorbing conductive sponge are more conducive to the application of FPGA in multiple scenarios.

Key words: FPGA, radiation emission, near field scanning, electromagnetic shielding material, electromagnetic radiation suppression