J4 ›› 2014, Vol. 36 ›› Issue (04): 579-583.
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LI Tiejun,SUN Yan,ZOU Jing,ZHANG Xiufeng
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Abstract:
To solve the problems of signal integrity and power integrity in DDR3 interface of FT1500 CPU,a simulation driven package design method is proposed.At the early stage,simulation is used to make accurate design rules and objectives. Then the package design is optimized repeatedly according to the simulation results.After the package design is completed, it is verified by the simulation.The design method is applied to FT1500 chip,whose DDR3 interface can work steadily with 1400Mbps.
Key words: high performance microprocessor;DDR3;signal integrity;power integrity;package design
LI Tiejun,SUN Yan,ZOU Jing,ZHANG Xiufeng. Simulation driven package design for FT1500 DDR3 interface [J]. J4, 2014, 36(04): 579-583.
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http://joces.nudt.edu.cn/EN/Y2014/V36/I04/579
