Abstract:

Thermal design of the IC package is to improve the thermal dissipation ability of the package. Multi chippackage (MCP) is designed to increase the density of integrated electronics and improve the processing power. Due to the multiheat sources in a package, heat management becomes more critical for MCPs. This paper presents the finite elements simulation of FBGA MCP product. The effect of chip thickness to the thermal resistance of the package is presented. Through a comparison of the thermal performances, the chip placement is optimized. The simulation results show that chip thickness does not have a profound effect to the thermal resistance of MCPs, and the smallest thermal resistance is obtained when the two chips are symmetrically arranged in the center of the substrate.

Key words: multichip package (MCP);FBGA;thermal management;finite elements simulation